ASM Pacific Technology
ASM Pacific Technology
Die Attach Equipment
Flip Chip Bonding
Wire Bonding Equipment
Showing all 9 results
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Die Attach System (3)
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Flip Chip Bonding (3)
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Wire bonder (3)
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AB589 Series Rotary Head Fine Aluminum Wire Bonding System
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AD211 Plus II Automatic Direct Eutectic Die Attach System
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AD280 Plus Automatic High Precision Die Attach System
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AD838L-G2 Automatic Die Attach System
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AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)
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AERO Series Automatic Wire Bonder
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AeroLED For LED Applications
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NANO Die Bonder and Flip Chip Bonder
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NOVA Plus Die Bonder and Flip Chip Bonder
