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HomeASM Pacific Technology

ASM Pacific Technology

ASM Pacific Technology
Die Attach Equipment
Flip Chip Bonding
Wire Bonding Equipment

Showing all 9 results

  • Die Attach System

    Die Attach System (3)

  • Flip Chip Bonding

    Flip Chip Bonding (3)

  • Wire bonder

    Wire bonder (3)

  • AB589 Series Rotary Head Fine Aluminum Wire Bonding System

  • AD211 Plus II Automatic Direct Eutectic Die Attach System

  • AD280 Plus Automatic High Precision Die Attach System

  • AD838L-G2 Automatic Die Attach System

  • AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)

  • AERO Series Automatic Wire Bonder

  • AeroLED For LED Applications

  • NANO Die Bonder and Flip Chip Bonder

  • NOVA Plus Die Bonder and Flip Chip Bonder

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Semiconductors, Hybrid Circuits, and Microelectronics.

 

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