ASM Pacific Technology
Die Attach Equipment
Flip Chip Bonding
Wire Bonding Equipment
Showing all 9 results
-
AB589 Series Rotary Head Fine Aluminum Wire Bonding System
-
AD211 Plus II Automatic Direct Eutectic Die Attach System
-
AD280 Plus Automatic High Precision Die Attach System
-
AD838L-G2 Automatic Die Attach System
-
AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)
-
AERO Series Automatic Wire Bonder
-
AeroLED For LED Applications
-
NANO Die Bonder and Flip Chip Bonder
-
NOVA Plus Die Bonder and Flip Chip Bonder