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HomeASM Pacific Technology

ASM Pacific Technology

ASM Pacific Technology
Die Attach Equipment
Flip Chip Bonding
Wire Bonding Equipment

Showing all 9 results

Die Attach System (3)
Flip Chip Bonding (3)
Wire bonder (3)
AB589 Series Rotary Head Fine Aluminum Wire Bonding System
AD211 Plus II Automatic Direct Eutectic Die Attach System
AD280 Plus Automatic High Precision Die Attach System
AD838L-G2 Automatic Die Attach System
AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)
AERO Series Automatic Wire Bonder
AeroLED For LED Applications
NANO Die Bonder and Flip Chip Bonder
NOVA Plus Die Bonder and Flip Chip Bonder

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Semiconductors, Hybrid Circuits, and Microelectronics.

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