AD211 Plus II Automatic Direct Eutectic Die Attach System

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AD211 Plus II Automatic Direct Eutectic Die Attach System

  • Accuracy ± 10 µm @ 3s
  • Direct ceramic substrate handling
  • Patented process and modules design
  • Individually controlled pick and bond system
  • Graphical SPC data with IQC system
  • Anti-thermal shock design for eutectic process
  • Gas supply formed during the process
  • Material traceability capability
  • Optional flip chip capability
Dimensions

W x D x H, 2,080 x 1,270 x 2,080 mm³