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High performance, accurate, flexible, reliable equipment’s for precision electronic industry
JFP Microtech Die Bonders
- MPS Mini-Place-System Very light Epoxy Die Bonder solution
- PP-ONE Manual placer Multipurpose platform for pick and place
- PP6 series; It’s the most versatile semi automatic Pick & Place platform
- PP7 series, 3 Dimension Die Bonder
JFP Microtech Rework Stations
- Manual Eutectic Station GG600: The gas-Gun eutectic station fulfill request for versatile soldering, eutectic, reflow of required in micro-electronic field.
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The PP6 Rework Station is a complete solution semi automatic Flip-Chip and flexible rework platform
JFP Microtech Scribers
- Scribe Model 100 is easy to use for singulation components for up to four (4”) inches
- Scribe Model 200 is easy to use for scribing components up to an eight (8”) inch wafer
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S-200 Scriber Breaker/Sorter (Model SBS 420): The Breaker Sorter is easy to use for scribing components on up to an eight (8”) inch wafer.