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HomeASM Pacific TechnologyWire bonder AeroLED For LED Applications
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AB589 Series Rotary Head Fine Aluminum Wire Bonding System
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AD211 Plus II Automatic Direct Eutectic Die Attach System

AeroLED For LED Applications

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Category: Wire bonder Tags: Hybrid, Semi
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Description

AeroLED For LED Applications

Revolutionary Features

  • Dual Directional Transducer
  • XY-Table of stable state
  • Precision control wire clamp gap
  • All material FAB controlled box
  • Nano Driver solution

Improved Performance

  • Up to 30% higher in UPH
  • 35μm bonded ball size
Dimensions

W x D x H = 1,200 x 900 x 1,760mm³

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