WELCOME TO BITA ELECTRONIQUE S.A.
SHARE
  • NEWSLETTER
  • CONTACT US
BITA ELECTRONIQUE S.A
Select category
  • Select category
  • Accuprobe
    • Accessories
    • Equipment
    • Probe
    • Probe Card
  • ASM Pacific Technology
    • Die Attach System
    • Flip Chip Bonding
    • Wire bonder
  • AUER PRECISION
    • Film frame
    • Flat Carrires
    • Magazines & Cassettes
    • Process Carriers
  • Aurel
    • Automatic Printing Line
    • Laser Systems
    • New Products
    • Screen Stencil Printers
  • Dr. Storage
    • Accessories
    • Baking Dry Cabinets
    • Dr. Storage Dry Cabinets
    • Hygrometer
    • Smart N2 Cabinet
  • FASTtechnologies
    • DNC UltraServer
    • NC-CAM Drill
    • NC-CAM Rout
    • SmartParts Cassetting
    • SmartParts Classics
    • SmartParts Monitoring
  • Hybond
    • Peg Bonder
    • Wire Bonders
    • Work Stages/ Workholders
  • JFP Microtech
    • JFP Microtech Die Bonders
    • Rework Station
    • Scriber
  • UniTemp
    • UniTemp HP-Series
    • UniTemp Rapid Thermal Process Ovens and Vacuum Process Oven
    • UniTemp Reflow Solder Systems
  • YES
    • Biomedical
    • Dielectric Vacuum Cure Ovens
    • High Vacuum Ovens
    • HMDS Prime Ovens + Image Reversal
    • Plasma Cleaning Systems
    • Plasma Strip/Descum Systems
    • Vapor Deposition Systems
    • YES Applications
    • YES Options
0 Wishlist
Menu
BITA ELECTRONIQUE S.A
  • Home
  • About
  • Contact us
  • Request a Quote
  • News
  • Newsletter
Click to enlarge
HomeASM Pacific TechnologyWire bonder AB589 Series Rotary Head Fine Aluminum Wire Bonding System
Previous product
WLP (Wafer-Level Packaging)
Back to products
Next product
AeroLED For LED Applications

AB589 Series Rotary Head Fine Aluminum Wire Bonding System

Add to wishlist
Add to quote loading
Category: Wire bonder Tag: Hybrid
Share
  • Description
  • Shipping & Delivery
Description

AB589 Series Rotary Head Fine Aluminum Wire Bonding System

Features

  • Fine pitch capability for advanced packages
  • High-precision rotary bond head design
  • Patented “PR on the Fly” capability
  • Large effective bonding area
  • Support universal carrier design for full range of applications (option)
  • Automatic material-handling capability (option)
Dimensions

W x D x H = 1,170 x 800 x 2,020 mm³

Shipping & Delivery

Related products

Accuprobe Card Holder
Quick view
Add to wishlist
Close

Probe Card Holder

Quick view
Add to wishlist
Close

2Z‑HVS-100

Quick view
Add to wishlist
Close

Z-Adjustable Probe

Probe Assembly Stations
Quick view
Add to wishlist
Close

Probe Assembly Station

Quick view
Add to wishlist
Close

RSS-110-S

Accuprobe Sensor
Quick view
Add to wishlist
Close

Probe Card Edge Sensor

Chip Resistor Probe Cards
Quick view
Add to wishlist
Close

Chip Resistor Probe Card

Dr. Storage Centralized Monitoring
Quick view
Add to wishlist
Close

ACE SensorLook Monitoring System

Bita Electronique S.A.

24, RUE SAINT-MATHIEU
LU-2138 LUXEMBOURG VILLE
Phone: (+352) 691 336053
Email: info@bita.lu
Our Offices
  • Luxembourg
  • Stockholm
  • Phnom Penh
Useful links
  • Privacy Policy
  • Terms & Conditions
  • Contact Us
BITA ELECTRONIQUE S.A - Established 1974 - On the web since 1998
payments
  • Home
  • About
  • Contact us
  • Request a Quote
  • News
  • Newsletter

We are using cookies to give you the best experience on our website.

You can find out more about which cookies we are using or switch them off in settings.

BITA ELECTRONIQUE S.A
Powered by  GDPR Cookie Compliance
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.

Strictly Necessary Cookies

Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.

If you disable this cookie, we will not be able to save your preferences. This means that every time you visit this website you will need to enable or disable cookies again.