AD280 Plus Automatic High Precision Die Attach System

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AD280 Plus Automatic High Precision Die Attach System

  • Accuracy ± 3 µm @ 3s
  • Epoxy stamping / dispensing
  • Material traceability capability
  • Patented bond head design
  • Up to 8” x 8” substrate handling
  • Optional
    • Flip chip capability
    • UV curing