AD280 Plus Automatic High Precision Die Attach System
Features
- Accuracy ± 3 µm @ 3s
- Epoxy stamping / dispensing
- Material traceability capability
- Patented bond head design
- Up to 8” x 8” substrate handling
- Optional
- Flip chip capability
- UV curing
This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.