AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)

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AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)

  • Dual heads flip chip bonding process at high throughput
  • Advanced Pattern Recognition System for high precision bonding
  • Capable of thin die handling
Dimensions

W x D x H = 2,440 x 1,995 x 1,600 mm³