AD838L-G2 Automatic Die Attach System

Category: Tags:

AD838L-G2 Automatic Die Attach System

  • Accuracy ± 10 µm @ 3s
  • Dual epoxy stamping / dispensing process
  • Direct ceramic substrate indexing
  • Anvil block with clamp force self-compensation design
  • Capable of panel bonding and with intelligent global substrate alignment
  • Material traceability capability
  • Suitable for CSP-LED application
  • Optional flip chip capability
Dimensions

W x D x H = 1,930 x 1,440 x 2,080 mm³