NANO Die Bonder and Flip Chip Bonder

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NANO Die Bonder and Flip Chip Bonder

  • Accuracy ± 0.3 µm @ 3s
  • Supports all die attach and flip chip applications
  • High precision alignment optics
  • Vibration damping system
  • Automatic placement offset tuning system
  • High resolution 300 mm bonding station
  • Dynamic alignment system
  • Quantitative parallelism calibration
  • In-situ eutectic bonding capability
  • 3x different heated options incl. laser soldering system
  • Active bond force control from 0.1 to 20N
  • Epoxy stamping and dispensing capability
  • UV curing capability at bond station
  • Post-bond inspection and wafer mapping software
  • Clean room inside with HEPA filter and ionizer
  • Modular machine concept
Dimensions

W x D x H = 1690 x 1430 x 2040 mm