RSO-200-HV Reflow Solder Oven with Vacuum

Note: VPO/VSS/RTP and RSO series are SPS/PLC based

Download (information): RSO-200-HV


UniTemp RSO-200-HV Reflow Solder Oven with Vacuum

Reflow Solder Oven Technical Data RSO-200-HV:

  • Loading area (max. part size): 200x170x40mm (WxDxH)
  • Quartz glass process chamber (fix mounted), incl.graphite susceptor
  • with integrated gas- in- and outlet
  • 1 Mass Flow Controller für Nitrogen 5 slm is standard
  • heated by 12 Infrared lamps (9kW)
  • bottom heating
  • vacuum up to 10exp-6 hPa (Turbomolecular and vacuum measurement included, rough pump on request)
  • SPS controller, SIMATIC
  • 50 programs with 50 steps each storable
  • 7″ Touch Panel for comfortable programming and process control
  • Ethernet interface
  • Max. Temperature: 650 °C
  • Ramp up rate: better 10 K/Sec
    Ramp down rate: T=600°C to 400°C max. 200 K/min
    T=400°C to 100°C max. 30K/min
  • Temperature control by thermocouple
  • Cooling: Water cooling required (option)
  • Electrical connection: CEE 16 A (2x230V, 3 Phase, +N, +PE, 9 kW)
  • Weight: about 65 kg
  • Dimension: 505mm x 504mm x 580mm
Options and accessories: 
RSO-200Basic unit
RSO-GPGraphite tray with cover
RSO-MFCAdditional gas line with mass flow controller (max. 4 gas lines)
RSO-H2Module for using 100% Hydrogen including one mass flow controller
RSO-H2SSafety device to prevent uncontrolled emission of Hydrogen
RSO-PC-200add. 200mm oven chamber ("double-chamber oven")
RSO-TCadd. thermocouple for measure on device (plugged in chamber)
WC IIIClosed loop water cooling system (stand-alone)

Download (information): RSO-200-HV