Model 522A-40 Thermosonic Ball Bonder

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Model 522A-40 Thermosonic Ball Bonder

The 522A-40 incorporates Hybond’s exclusive Soft Touch™ force ramping system that bonds effectively even to sensitive materials.

Superior wire control is provided by a motorized feed system which features front panel operator adjustment of tail length.

Model 522A-40 sets the industry standard for ease of operation and maintenance. Front panel operator controls include force, ultrasonic time, ultrasonic energy, tail length, EFO power, and stage heat.

The 4:1 X-Y manipulator stage movement and Z axis bond motion are conveniently located to reduce operator fatigue.

Precision machined mechanical components with sealed ball bearings at major points are durable and trouble-free. Modular electronics facilitate quick and cost-effective maintenance.

Standard Features

  • Hybond Soft Touch energy system
  • Independent Z-axis lever for bonding tool control
  • Motorized vertical wire feed
  • 1-2-2 stitch capability
  • 0.5 and 2 inch spool mounts
  • Loop height control adjustment
  • Electronic ball size control
  • Swing-away wire clamp assembly
  • Deep vertical access of 0.53 inch
  • Long horizontal reach of 6.5 inches
  • High and Low EFO power
  • Independent control of 1st & 2nd bond parameters
  • Tail length adjustable
  • Audio & visual bond sequence fault indicators
  • 10 x 12 inch work platform
  • LED display of work stage temperature
  • Infinite angle microscope mounting
  • Front panel ultrasonic test button
  • Comfortably fits 10 x 10 inch module or substrate

Optional Features

  • Leica Stereo Zoom microscope (OP-06S6T)
  • Nikon SMZ660 microscope (OP-06A)
  • Dual fiber-optic illuminator (OP-08A)
  • 240 VAC 50/60 Hz input wiring (OP-12)
  • Bump Bonding Capability (OP-13)
  • 8:1 X-Y manipulator (OP-30A)
  • High & low ultrasonic power (OP-44)
  • 2.125″ diameter heated workstage (WST-15A)
  • 4″ x 4″ heated workstage (WST-19B)
  • 10″ X 6″ heated workstage (WST-65)
Specification: 
Ultrasonic System:PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
Ultrasonic Power Range:0-1 watt on Low setting (default), 0-2 watts on High setting
Bond Time Range:10– 400 mSec
Bond Force Range:15– 150 grams
Temperature Control Range:Ambient to 250° C
Bondable Wire Diameters:0.7 to 2.0 mils (18 to 50,8 µm)
Bondable Wire Materials:Gold wire
Bonding Capillary Length:0.750″
Bond Head Movement:Manual
Bond Actuation: Switch at fixed height, actuated by lever
Z Axis Travel:0.5 in (1,20 cm) maximum
Vertical Bonding Window: 60 -100 mils (152-254 µm) max dist. between 1st & 2nd bond
Table Motion:4:1, manual
Input Power Requirements:120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
Minimum Bench Space Required:20″x20″ (50,8cmx50,8cm)
Unit Weight/Shipping Weight:70/150 lbs. (50,8/63,5 Kg). Shipping weight will vary.
Industry Standards:CE certified

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