NOVA Plus Die Bonder and Flip Chip Bonder

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NOVA Plus Die Bonder and Flip Chip Bonder

  • Accuracy +/- 2.5 µm @ 3s
  • Cycle time < 3 sec
  • Modular machine concept for all micro assembly applications
  • Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
  • Multi flip chip bonding
  • Wafer mapping
  • Post bond inspection/ measurement
  • Substrate working area of 550 x 600 mm
  • Active bond-force-control
  • Autoloading for up to
    • 12″ wafers
    • 300 mm wafers
    • 450 mm substrate wafers
  • Optional
    • UV Curing
    • Dispensing
Dimensions

W x D x H = 1240 x 2140 x 1980 mm