AD211 Plus II Automatic Direct Eutectic Die Attach System
Features
- Accuracy ± 10 µm @ 3s
- Direct ceramic substrate handling
- Patented process and modules design
- Individually controlled pick and bond system
- Graphical SPC data with IQC system
- Anti-thermal shock design for eutectic process
- Gas supply formed during the process
- Material traceability capability
- Optional flip chip capability
Dimensions
W x D x H, 2,080 x 1,270 x 2,080 mm³
