UniTemp Model HP-300 Hot Chuck
This high precision hot chuck has a heated area with 310 x 310 mm.
It can be used as build-in or stand-alone chuck with an external controller.
The vacuum hot plate has vacuum holes in a pitch of 25mm each (1mm Diameter) for holding the substrate or wafer.
The maximum temperature is 300 °C.
incl. Software for managing the temperature profiles
IP code 23
Download (information): HP-300
Category: UniTemp HP-Series Tag: Hybrid