HP-60

UniTemp Model HP-60 Hot Chuck

Applications examples:

  • Reflow Soldering of flat components
  • Preheating of heavy parts for soldering,
  • annealing.
  • curing of photoresists and epoxies

Optional:
Waffle pack holder Slotted Top Plate for DIL housing for HP-90Top plate for T03 housingTop plate for T05/T08 housing

Technical Data: 
Heated Area:60 mm diameter
Temperature Range:up to 250 °C
Power supply:40V, 80Watts
Dimension:dia. 80mm total
Weight>0,6 kg
External Temperature Controller:HC-40

Download (information): Hot Chucks

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