WELCOME TO BITA ELECTRONIQUE S.A.
SHARE
  • NEWSLETTER
  • CONTACT US
BITA ELECTRONIQUE S.A
Select category
  • Select category
  • Accuprobe
    • Accessories
    • Equipment
    • Probe
    • Probe Card
  • ASM Pacific Technology
    • Die Attach System
    • Flip Chip Bonding
    • Wire bonder
  • AUER PRECISION
    • Film frame
    • Flat Carrires
    • Magazines & Cassettes
    • Process Carriers
  • Aurel
    • Automatic Printing Line
    • Laser Systems
    • New Products
    • Screen Stencil Printers
  • Dr. Storage
    • Accessories
    • Baking Dry Cabinets
    • Dr. Storage Dry Cabinets
    • Hygrometer
    • Smart N2 Cabinet
  • FASTtechnologies
    • DNC UltraServer
    • NC-CAM Drill
    • NC-CAM Rout
    • SmartParts Cassetting
    • SmartParts Classics
    • SmartParts Monitoring
  • Hybond
    • Peg Bonder
    • Wire Bonders
    • Work Stages/ Workholders
  • JFP Microtech
    • JFP Microtech Die Bonders
    • Rework Station
    • Scriber
  • UniTemp
    • UniTemp HP-Series
    • UniTemp Rapid Thermal Process Ovens and Vacuum Process Oven
    • UniTemp Reflow Solder Systems
  • YES
    • Biomedical
    • Dielectric Vacuum Cure Ovens
    • High Vacuum Ovens
    • HMDS Prime Ovens + Image Reversal
    • Plasma Cleaning Systems
    • Plasma Strip/Descum Systems
    • Vapor Deposition Systems
    • YES Applications
    • YES Options
0 Wishlist
Menu
BITA ELECTRONIQUE S.A
  • Home
  • About
  • Contact us
  • Request a Quote
  • News
  • Newsletter
Click to enlarge
HomeHybondWire Bonders Model 626 Multipurpose Digital Thermosonic Wire Bonder
Previous product
HP-60
Back to products
Next product
Model 616B-001 Digital Ultrasonic Peg Bonder

Model 626 Multipurpose Digital Thermosonic Wire Bonder

Add to wishlist
Add to quote loading
Category: Wire Bonders Tag: Hybrid
Share
  • Description
  • Shipping & Delivery
Description

Model 626 Multipurpose Digital Thermosonic Wire Bonder

Model 626 is a Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump or Peg bonder. The 626 can be used for wire diameters from 0.7 to 2.0 mil (18 to 51µm) gold wire when in ball bonder configuration or 0.5 to 3.0 mil (12 to 76µm) and ribbon up to 1.0 x 12.0 mil (25 x 300µm) when in wedge or Peg bonding mode.
The 626 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bond and for bonding wires to sensitive devices such as gallium arsenide FET’s and LED’s.
Model 626’s motorized wire feed and wire/ribbon clamping system provide superior wire/ribbon control and allow the operator to increase or decrease tail length in 1 mil (25µm) increments at a touch of a switch. 626 shows actual units for set up of bond parameters.

Change over from Ball bonder to Wedge bonder requires only a press of a button to turn EFO power to zero and a change from capillary to wedge tool. 626 can also operate in Bump or Peg bonding modes. Add OP-47 for pick, place and bond feature.

Standard Features

  • Hybond Soft Touch energy system
  • 100 Bond schedules programmable in non-volatile memory
  • Selectable / adjustable reset heights (constant or adaptive)
  • 1-2-2 auto stitch or manual continuous stitch in manual & auto modes when ball bonding
  • Sensor controlled bond actuation for variable bonding height
  • 0.740 inch max. vertical bonding window
  • Deep vertical access of 0.53″ (1,34cm)
  • Static dissipative enclosure
  • Ball, Wedge, Bump or Peg bond capable
  • Horizontal reach of 6.5″ (16,51cm)
  • Programmable loop and search heights
  • Built-in digital temperature controller
  • High / low power PLL ultrasonic generator
  • Swing-away wire clamp assembly
  • 0.5 and 2 inch spool mounts
  • Z-axis movement controlled by footswitches or manipulator
  • Motorized Z-axis control in auto and manual modes
  • Audio and visual bond indicators
  • Electronic ball size control 0-4x wire dia.

Optional Features

  • Leica Stereo Zoom microscope (OP-06S6)
  • Nikon SMZ660 microscope (OP-06A)
  • Dual fiber-optic illuminator (OP-08A)
  • 8:1 X-Y Manipulator (OP-30A)
  • Tool heater with temperature controller (OP-31)
  • Heated Ultrasonic Transducer (OP-82)
  • 2.125″ diameter heated workstage(WST-15A)
  • 4″ x 6″ heated workstage (WST-19A)
  • 10″ x 6″ heated workstage (WST-65)
  • Wire & Ball tool as ordered per application
Specification:
Ultrasonic System:PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
Ultrasonic Power Range:0- 0.2 watt on Low setting (default), 0- 2 watts on High setting
Bond Time Range:0– 900 mSec
Bond Force Range:12– 250 grams
Temperature Control Range:Ambient to 250° C
Bondable Wire Diameters:0.5 to 3.0 mils (12.7 to 76,2 µm)
Bondable Ribbon Dimensions:1 x 20.0 mils (25,4 to 510 µm) in wedge bonder mode
Bondable Wire/Ribbon Materials:Gold, (aluminum and gold coated copper for wedge bonder)
Bond Head Movement:Motorized (servo); activated by manipulator switches or footswitches
Bond Actuation: By sensor at bond surface contact
Z Axis Travel:0.75 in (1,90 cm)
Vertical Bonding Window: 0.74 in (1,88 cm)
Table Motion:4:1, manual
Input Power Requirements:90- 260 VAC 50/60 Hz @ 10A max
Minimum Bench Space Required:20″x20″ (50,8cmx50,8cm)
Unit Weight/Shipping Weight:70 lbs (31,8Kg)/150 lbs. Shipping weight will vary
Industry Standards:CE certified

Download (information): MODEL 626

Shipping & Delivery

Related products

Quick view
Add to wishlist
Close

Process Carriers

YES 1000-LMC
Quick view
Add to wishlist
Close

YES G1000LMC

Quick view
Add to wishlist
Close

2Z‑HVS-100

RSS 3X210-S
Quick view
Add to wishlist
Close

RSS 3X210-S

ACCUPROBE Ceramic Blade
Quick view
Add to wishlist
Close

Ceramic Blade Probe

Quick view
Add to wishlist
Close

Blade Spring (pogo) Probe

Dr. Storage Centralized Monitoring
Quick view
Add to wishlist
Close

ACE SensorLook Monitoring System

Accuprobe Card Holder
Quick view
Add to wishlist
Close

Probe Card Holder

Bita Electronique S.A.

24, RUE SAINT-MATHIEU
LU-2138 LUXEMBOURG VILLE
Phone: (+352) 691 336053
Email: info@bita.lu
Our Offices
  • Luxembourg
  • Stockholm
  • Phnom Penh
Useful links
  • Privacy Policy
  • Terms & Conditions
  • Contact Us
BITA ELECTRONIQUE S.A - Established 1974 - On the web since 1998
payments
  • Home
  • About
  • Contact us
  • Request a Quote
  • News
  • Newsletter

We are using cookies to give you the best experience on our website.

You can find out more about which cookies we are using or switch them off in settings.

BITA ELECTRONIQUE S.A
Powered by  GDPR Cookie Compliance
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.

Strictly Necessary Cookies

Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.

If you disable this cookie, we will not be able to save your preferences. This means that every time you visit this website you will need to enable or disable cookies again.