NOVA Plus Die Bonder and Flip Chip Bonder
Features
- Accuracy +/- 2.5 µm @ 3s
- Cycle time < 3 sec
- Modular machine concept for all micro assembly applications
- Eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
- Multi flip chip bonding
- Wafer mapping
- Post bond inspection/ measurement
- Substrate working area of 550 x 600 mm
- Active bond-force-control
- Autoloading for up to
- 12″ wafers
- 300 mm wafers
- 450 mm substrate wafers
- Optional
- UV Curing
- Dispensing
Dimensions
W x D x H = 1240 x 2140 x 1980 mm
