NANO Die Bonder and Flip Chip Bonder
Features
- Accuracy ± 0.3 µm @ 3s
- Supports all die attach and flip chip applications
- High precision alignment optics
- Vibration damping system
- Automatic placement offset tuning system
- High resolution 300 mm bonding station
- Dynamic alignment system
- Quantitative parallelism calibration
- In-situ eutectic bonding capability
- 3x different heated options incl. laser soldering system
- Active bond force control from 0.1 to 20N
- Epoxy stamping and dispensing capability
- UV curing capability at bond station
- Post-bond inspection and wafer mapping software
- Clean room inside with HEPA filter and ionizer
- Modular machine concept
Dimensions
W x D x H = 1690 x 1430 x 2040 mm
