ASM Pacific Technology Die Attach Equipment

• Model AD211 Plus II Automatic Direct Eutectic Die Attach System
• Model AD280 Plus Automatic High Precision Die Attach System
• Model AD838L-G2 Automatic Die Attach System

ASM Pacific Technology Flip Chip Bonding

• Model AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)
• Model NANO Die Bonder and Flip Chip Bonder
• Model NOVA Plus Die Bonder and Flip Chip Bonder

ASM Pacific Technology Wire Bonding Equipment

• Model AB589 Series Rotary Head Fine Aluminum Wire Bonding System
• Model AERO Series Automatic Wire Bonder
• Model AeroLED For LED Applications