UniTemp RSO-200-HV Reflow Solder Oven with Vacuum
Reflow Solder Oven Technical Data RSO-200-HV:
- Loading area (max. part size): 200x170x40mm (WxDxH)
- Quartz glass process chamber (fix mounted), incl.graphite susceptor
- with integrated gas- in- and outlet
- 1 Mass Flow Controller für Nitrogen 5 slm is standard
- heated by 12 Infrared lamps (9kW)
- bottom heating
- vacuum up to 10exp-6 hPa (Turbomolecular and vacuum measurement included, rough pump on request)
- SPS controller, SIMATIC
- 50 programs with 50 steps each storable
- 7″ Touch Panel for comfortable programming and process control
- Ethernet interface
- Max. Temperature: 650 °C
- Ramp up rate: better 10 K/Sec
Ramp down rate: T=600°C to 400°C max. 200 K/min
T=400°C to 100°C max. 30K/min - Temperature control by thermocouple
- Cooling: Water cooling required (option)
- Electrical connection: CEE 16 A (2x230V, 3 Phase, +N, +PE, 9 kW)
- Weight: about 65 kg
- Dimension: 505mm x 504mm x 580mm
| Options and accessories: | |
|---|---|
| RSO-200 | Basic unit |
| RSO-GP | Graphite tray with cover |
| RSO-MFC | Additional gas line with mass flow controller (max. 4 gas lines) |
| RSO-H2 | Module for using 100% Hydrogen including one mass flow controller |
| RSO-H2S | Safety device to prevent uncontrolled emission of Hydrogen |
| RSO-PC-200 | add. 200mm oven chamber ("double-chamber oven") |
| RSO-TC | add. thermocouple for measure on device (plugged in chamber) |
| WC III | Closed loop water cooling system (stand-alone) |
Download (information): RSO-200-HV
