AD838L-G2 Automatic Die Attach System
Features
- Accuracy ± 10 µm @ 3s
- Dual epoxy stamping / dispensing process
- Direct ceramic substrate indexing
- Anvil block with clamp force self-compensation design
- Capable of panel bonding and with intelligent global substrate alignment
- Material traceability capability
- Suitable for CSP-LED application
- Optional flip chip capability
Dimensions
W x D x H = 1,930 x 1,440 x 2,080 mm³
