ASM Pacific Technology

Model AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)
Model NANO Die Bonder and Flip Chip Bonder
Model NOVA Plus Die Bonder and Flip Chip Bonder

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AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)

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NANO Die Bonder and Flip Chip Bonder

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NOVA Plus Die Bonder and Flip Chip Bonder