Model 616B-005 Thermosonic Peg Bonder

Model 616B-005 thermosonic single channel peg bonder has been designed to perform thermosonic attachment of insulated or bare wire / ribbon.
This unit contains a built-in in temperature controller.
Applications include hard disk head stack assemblies, head gimbal assemblies, microwave, sensor circuits, ball coining, flex-on-flex, ribbon tacking, pin-tab bonding, and mesh bonding.

Standard Features

Hybond Soft Touch energy system
Motorized Z axis control
1.5 inch vertical bonding window
Variable height bonding within 1.5 inch
Built-in temperature controller
Search height adjustable in 0.001 inch increments
0-900 mSec bond time
Wiring for 120 VAC 50/60Hz @ 10A Max.

Optional Features

Leica Stereo Zoom microscope (OP-06S6T)
Nikon SMZ660 microscope (OP-06A)
Dual fiber-optic illuminator (OP-08A)
240 VAC 50/60 Hz input wiring (OP-12)
Bonder capability for vacuum pick & place (OP-47)
8:1 X-Y Manipulator (OP-30)
Pick-up / Bond Tool (BLDBT-X) used with OP-47
Peg Tool (PT-X.X)

Specification:
Ultrasonic System:	PLL self-tuning, 62.5 KHz (±2.5KHz) nominal
Ultrasonic Power Range:	0-2 watt on Low setting (default), 0-4 watts on High setting
Bond Time Range:	0– 900 mSec
Bond Force Range:	12– 300 grams
Bondable Wire Diameters:	0.5 to 2.0 mils (12.5 to 50 µm) insulated; 0.5 to 2.0 mils (12.5 to 50 µm) bare
Bondable Ribbon Diameters:	1 x 20.0 mils (25 to 500 µm)
Bondable Wire/Ribbon Materials:	Gold, gold plated copper, and aluminum
Bond Head Movement:	True vertical motorized movement
Bond Actuation:	Sensor at variable height, pushbutton or footswitch
Z Axis Travel:	1.5 inch (3,81 cm)
Vertical Bonding Window:	1.4 inch (3,55 cm)
Table Motion:	4:1, manual
Input Power Requirements:	120 VAC 50/60 Hz @ 10A (std) or 240 VAC 50/60 Hz @ 5A
Minimum Bench Space Required:	20″x20″ (50,8cmx50,8cm)
Unit Weight/Shipping Weight:	45/135 lbs. (24,4/61,2 Kg). Shipping weight will vary.
Industry Standards:	CE certified