PP6 series (Universal Die Bonder)

JFP Microtech PP6 series

It’s the most versatile semi automatic Pick & Place platform. It can be used in a wide field of applications such as ASIC, MMIC, MEMS or VECEL.

PP5 and PP6 are user friendly, flexible and requires minimal training to operate.

Eutectic and Epoxy available.

Download (information): PP6-6 Flip-Chip/Die-Bonder