UniTemp RSS-160-S Reflow Solder System
Mini Vacuum Reflow Solder System
The reflow solder system is perfect for the following applications:
- flux-less soldering
- flip chip process
- adhesive bonding
- solder bump reflowing
- encapsulation of housings
- soldering of power devices
- heat treatment of semiconductor wafers
- prototype development
- quality control
Technical Data:
- heated area: 160 mm x 160 mm (= model RSS-160-S)
- chamber height: 40 mm (optional up to 80 mm)
- viewing window with 60 mm dia.
- Mass Flow controller for Nitrogen (5 nlm)
- vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
- temperature up to 400 °C (optional up to 500 °C)
- ramp up rate: better 100 K/minute
- ramp down rate: better 100 K/minute
- SIMATIC© process control with 50 programs and 50 steps each
- 7″ touch panel
- water cooled chamber (controlled and watched)
- electrical connection type: 230V, 2.4 kW or 115V, 1.2 kW
| Options and accessories: | |
|---|---|
| FA I | Formic acid module (separate module, not integrated) with Mass Flow Controller |
| FA II | integrated formic acid module with Mass Flow Controller |
| FA III | integrated formic acid module with shared Mass Flow Controller |
| MFC | additional Mass Flow Controller (max. 2 pcs) |
| RSS-EH | Chamber height 80mm instead of 40mm |
| RSS-H2 | Hydrogen Module: for using 100% Hydrogen incl. gas line with Mass Flow Controller |
| RSS-H2S | Safety device to prevent uncontrolled emission of Hydrogen |
| RSS-IL | Interlock mechanism during operation |
| RSS-TC | Additional thermocouple (max. 3 pc) |
| VAC I | Basic Vacuum up to 3 hPa, incl. vacuum sensor and valve, excl. pump |
| VAC II | Comfort Vacuum up to 10E-3 hPa, incl, vacuum sensor and valve, excl. pump |
| MP | Membrane/Diaphragm pump for vacuum up to 3 hPa |
| MPC | Chemical resistant membrane pump for vacuum up to 3 hPa |
| RVP | Rotary vane pump for vacuum up to 10E-3 hPa with oil filter |
| WC I | Closed loop water cooling system |
Download (information): RSS-110-S, RSS-160-S and RSS-210-S
