UniTemp RSS-210-S

Vacuum Reflow Solder System

The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.

The reflow solder system is perfect for the following applications:

• flux-less soldering
• flip chip process
• adhesive bonding
• solder bump reflowing
• encapsulation of housings
• soldering of power devices
• heat treatment of semiconductor wafers
• prototype development
• quality control

Technical Data:

• heated area: 210 mm x 210 mm (= model RSS-110-S)
• chamber height: 60 mm (optional up to 80 mm)
• viewing window with 60 mm dia.
• Mass Flow controller for Nitrogen (5 nlm)
• vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
• temperature up to 400 °C (optional up to 500 °C)
• ramp up rate:      better 240 K/minute
• ramp down rate:  better 120 K/minute
• SIMATIC© process control with 50 programs and 50 steps each
• 7″ touch panel
• water cooled chamber (controlled and watched)
• electrical connection type: 230V, 9 kW or 115V, 7 kW

Options and accessories