UniTemp RSS-210-S


UniTemp RSS-210-S

Vacuum Reflow Solder System

The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.

The reflow solder system is perfect for the following applications:

  • flux-less soldering
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • encapsulation of housings
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

Technical Data:

  • heated area: 210 mm x 210 mm (= model RSS-110-S)
  • chamber height: 60 mm (optional up to 80 mm)
  • viewing window with 60 mm dia.
  • Mass Flow controller for Nitrogen (5 nlm)
  • vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
  • temperature up to 400 °C (optional up to 500 °C)
  • ramp up rate:      better 240 K/minute
  • ramp down rate:  better 120 K/minute
  • SIMATIC© process control with 50 programs and 50 steps each
  • 7″ touch panel
  • water cooled chamber (controlled and watched)
  • electrical connection type: 230V, 9 kW or 115V, 7 kW

Options and accessories

Next Product
Previous Product