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UniTemp RSO-300 Reflow Solder Oven

Reflow Solder Oven Technical Data RSO-300:

  • Loading area (max. part size): 300 mm x 300 mm x 35  mm (LxBxH)
  • Incl. quartz glass holder and quartz glass try for placing of 100mm, 150mm, 200mm oder 300mm Wafer size
  • with integrated gas- in- and outlet
  • 1 Mass Flow Controller for Nitrogen 5 nlm is standard
  • heated by 12 Infrared lamps ( 12kW)
  • bottom heating
  • vacuum for external pump system (up to 10exp.-3 hPa)
  • SPS (PLC) controller, SIMATIC
  • 50 programs with 50 steps each storable
  • 7″ Touch Panel for comfortable programming and process control
  • Ethernet interface
  • Max. Temperature: 650 °C
  • Ramp up rate: better 10 K/Sec
    Ramp down rate: T=600°C to 400°C max. 250 K/min
    T=400°C to 100°C max. 30K/min
  • Temperature control by thermocouple
  • Cooling: Water cooling required (option)
  • Electrical connection: CEE 16 A (3x400V, 3 Phase, +N, +PE)
  • Weight: about 70 kg
  • Dimension: 578 mm x 496 mm x 570 mm (WxDxH)