UniTemp RSO-300 Reflow Solder Oven
Reflow Solder Oven Technical Data RSO-300:
- Loading area (max. part size): 300 mm x 300 mm x 35 mm (LxBxH)
- Incl. quartz glass holder and quartz glass try for placing of 100mm, 150mm, 200mm oder 300mm Wafer size
- with integrated gas- in- and outlet
- 1 Mass Flow Controller for Nitrogen 5 nlm is standard
- heated by 12 Infrared lamps ( 12kW)
- bottom heating
- vacuum for external pump system (up to 10exp.-3 hPa)
- SPS (PLC) controller, SIMATIC
- 50 programs with 50 steps each storable
- 7″ Touch Panel for comfortable programming and process control
- Ethernet interface
- Max. Temperature: 650 °C
- Ramp up rate: better 10 K/Sec
Ramp down rate: T=600°C to 400°C max. 250 K/min
T=400°C to 100°C max. 30K/min - Temperature control by thermocouple
- Cooling: Water cooling required (option)
- Electrical connection: CEE 16 A (3x400V, 3 Phase, +N, +PE)
- Weight: about 70 kg
- Dimension: 578 mm x 496 mm x 570 mm (WxDxH)
