HP-155

UniTemp Model HP-155 Hot Plate

Compact hot plate with integrated precision controller Reflow of any soldering alloy Pre-heating for wire bonding Expoy curing Laboratory tests

Technical Data: 
Heated Area:up to 350 °C
Power supply:230V, 1000 Watts or 115V, 1000 Watts
Dimension HP-155:32 mm x 21 mm x 55 mm
Weight>3,5kg

Download (information): High Precision Hot Plates

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