Polyimide Cure/Bake/Anneal
Benzocyclobutene (BCB) is used to create photosensitive polymers, which require fewer processing steps than dry etch materials. BCB-based polymer dielectrics may be spun on or applied to a variety of substrates for use in MicroElectro-Mechanical Systems (MEMS) and microelectronics processing.
Typical applications:
- Adhesive wafer bonding
- Low-K dielectrics
- CMOS
- Bipolar devices
- Optical interconnects
- Intracortical neural implants
BCB’s primary advantage over other polymers is its compatibility with conventional integrated circuit (IC) processing techniques as well as with various metallization systems. BCB also has a low-K dielectric, a low dissipation factor at high frequencies, low moisture absorption, and a high degree of planarization.
YES-450PB ovens and the fully automated YES-VertaCure are ideally suited for this process.
