UniTemp RSS 3X210-S

Description

Reflow Solder System for serial production

The RSS-3X210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.

The reflow solder system is perfect for the following applications:

  • flux-less soldering
  • flip chip process
  • adhesive bonding
  • solder bump reflowing
  • soldering of power devices
  • heat treatment of semiconductor wafers
  • prototype development
  • quality control

Technical Data:

  • heated area: 3 heated plates with each 210 mm x 210 mm
  • chamber height: 40 mm (optional up to 80 mm)
  • Mass Flow controller for Nitrogen (5 nlm)
  • vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
  • temperature up to 300 °C (higher on request)
  • ramp up rate:      better 120 K/minute
  • ramp down rate:  better 60 K/minute
  • SIMATIC© process control with 50 programs and 50 steps each
  • 7″ touch panel
  • water cooled chamber (controlled and watched)
  • electrical connection type: 3x 230V,3P, +N, 18 kW