UniTemp RSO-200-HV Reflow Solder Oven

Description

Reflow Solder Oven Technical Data RSO-200-HV:

  • Loading area (max. part size): 200x170x40mm (WxDxH)
  • Quartz glass process chamber (fix mounted), incl.graphite susceptor
  • with integrated gas- in- and outlet
  • 1 Mass Flow Controller für Nitrogen 5 slm is standard
  • heated by 12 Infrared lamps (9kW)
  • bottom heating
  • vacuum up to 10exp-6 hPa (Turbomolecular and vacuum measurement included, rough pump on request)
  • SPS controller, SIMATIC
  • 50 programs with 50 steps each storable
  • 7″ Touch Panel for comfortable programming and process control
  • Ethernet interface
  • Max. Temperature: 650 °C
  • Ramp up rate: better 10 K/Sec
    Ramp down rate: T=600°C to 400°C max. 200 K/min
    T=400°C to 100°C max. 30K/min
  • Temperature control by thermocouple
  • Cooling: Water cooling required (option)
  • Electrical connection: CEE 16 A (2x230V, 3 Phase, +N, +PE, 9 kW)
  • Weight: about 65 kg
  • Dimension: 505mm x 504mm x 580mm