UniTemp HP-60

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Description

Applications examples:

  • Reflow Soldering of flat components
  • Preheating of heavy parts for soldering,
  • annealing.
  • curing of photoresists and epoxies

Optional:
Waffle pack holder Slotted Top Plate for DIL housing for HP-90Top plate for T03 housingTop plate for T05/T08 housing

Technical Data: UniTemp HP-60-en

Specs Hot Chucks: hotchucks0511