Semiconductor

Showing 1–36 of 43 results

2Z-HVS-200

AD211 Plus II Automatic Direct Eutectic Die Attach System

AD280 Plus Automatic High Precision Die Attach System

AD838L-G2 Automatic Die Attach System

AD9212 Plus Automatic Flip Chip Bonding System (12” wafer handling)

AERO Series Automatic Wire Bonder

AeroLED For LED Applications

Film Frames

Flat Carriers

Full Automatic Screen Printing Line VS1520M

Hot chucks with external controller

HP-220

HPP-155

Magazines & Cassettes

Metal Blade Probe

Model 522A Thermosonic Ball Bonder

Model 522A-40 Thermosonic Ball Bonder

Model 572A Thermosonic Wedge Bonder

Model 572A-40 Thermosonic Wedge Bonder

Model 616B-001 Digital Ultrasonic Peg Bonder

Model 616B-003 Digital Ultrasonic Peg Bonder

Model 616B-005 Thermosonic Peg Bonder

Model 676 Digital Thermosonic Wedge Bonder

NANO Die Bonder and Flip Chip Bonder

NOVA Plus Die Bonder and Flip Chip Bonder

PP6 Flexible Rework station

RSO-200 Reflow Solder Oven

RSO-200-HV Reflow Solder Oven with Vacuum

RSO-300 Reflow Solder Oven

RTP-100-HV (High Vacuum) front loading

RTP-100, front loading

RTP-150-EP (NEW), front loading

RTP-150-HV (High Vacuum), front loading

RTP-150, front loading

RTP-200 Reflow Solder Oven

RVS-210