RTP-150-EP (NEW), front loading

Note: VPO/VSS/RTP and RSO series are SPS/PLC based

Download (information): RTP-150-EP

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Description

UniTemp RTP-150-EP (NEW), front loading

Rapid Thermal Vacuum Process Oven with ramp up rate up to 150 K/sec.

Key features are

  • good temperature uniformity
  • precisely controlled ramp-up rates and fast ramp-down rates
  • low process turnaround
  • comfortable gas control
  • table top system with small foot print

Multipurpose table top unit with front loading drawer for the following applications:

  • excellent tool for various semiconductor processes
  • implementing of new semiconductor processes
  • prototype research
  • quality control
  • annealing
  • Rapid Thermal Processes
  • SiAu, SiAl, SiMo alloying
  • low k dielectrics
  • post implanting annealing
  • copper paste firing
  • resistor paste firing
  • other processes on demand

Technical Data:

  • for single wafer up to 150 mm (6″) or 156 mm x 156 mm substrate size
  • (optional: adapter for 100 mm)
  • process chamber made of quartz glass (chamber height: 40 mm)
  • with integrated gas in- and outlet
  • incl. one process gas line with Mass Flow Controller for Nitrogen (5 nlm = norm liter per min.)
  • heated by 24 infrared lamps (42 kW)
  • top and bottom heating
  • ramp down rate: T=1000 °C˃400 °C 200 K/min.
    ramp down rate: T=  400 °C˃100 °C   30 K/min.
  • vacuum capable for external pump system (up to 10E-3 hPa, for up to 10E-6 hPa: see RTP-150-HV)
  • SPS (PLC) process controller with 50 programs and up to 50 steps each (ethernet interface), SIMATIC
  • 7″ touch panel for easy programming and process control
  • max. temperature 1000 °C
  • temperature control by thermocouple
  • water cooling required
  • electrical connection type: 2x[32 A CEE plug (3 x 230 V, 3 Phase, N, PE>
  • dimension oven: 504 mm x 504 mm (700) x 570 mm (w x d x h)
  • weight: 58 kg

The oven will be programmed by a Siemens SPS (PLC) controller. This allows the storage of 50 programs with saving all temperature profiles and segments.
Options and accessories like water cooler, additional flow meters, additional gas lines, additional thermocouple etc. are available on request. This tool
is for various applications and customers. The small size allows comfortable loading and unloading of the chamber. The oven can be easily placed on
a standard laboratory table.

Options and accessories: 
RTP-150-EPBasic unit with 1 MFC for Nitrogen (5 nlm = Normliter pro Minute)
RTP-MFCMass Flow Controller (max. 4 in total)
RTP-GPGraphite plate or susceptor
RTP-PC-150Additional oven chamber for parallel usage with one process controller unit (double pack oven) 150 mm; no simultaneous operation of both chambers possible
RTP-QPQuartz plate
RTP-QC-150 spare quartz chamber for RTP-150
RTP-TCadditional thermocouple to measure on device (plugged in chamber) (max. 3 pcs.)
WC IIIClosed loop water cooling system
VacuumWe offer suitable vacuum equipment also vacuum pumps as option (10 hPa up to 10-exp3hPa). High vacuum: see RTP-150-HV

Download (information): RTP-150-EP