HP-300

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Description

UniTemp HP-300

This high precision hot chuck has a heated area with 310 x 310 mm.
It can be used as build-in or stand-alone chuck with an external controller.

The vacuum hot plate has vacuum holes in a pitch of 25mm each (1mm Diameter)
for holding the substrate or wafer.

The maximum temperature is 300 °C.

3-Zone-temperature measurement

incl. Software for managing the temperature profiles

IP code 23

Download (information): DBHP-300EN