05 Nov YES VertaVac (fully automated) The YES-VertaVac series of automated high vacuum ovens is designed for today’s most demanding MEMS and semiconductor process applicatio...Continue reading
05 Nov YES PB-HV Series (manual load) YES-PB8 High Vac Specs (up to 200mm wafers) YES-PB12 High Vac Specs (up to 300mm wafers) Process Management Software Stainless Steel Pr...Continue reading
05 Nov YES-VertaCoat (automated) The YES-VertaCoat automated, silane vapor deposition system is designed for today’s most advanced MEMS and semiconductor process applic...Continue reading
04 Nov YES-EcoCoat (manual) YES-ÉcoCoat (formerly YES-1224P) Overview Process Management Software (option) Two Silane CVD Treatment (published article) CVD of Thre...Continue reading
04 Nov YES-LabCoat (R&D size) Whether you need a moisture resistant barrier or a reactive surface for your application, the YES-LabCoat is especially suited for achi...Continue reading
03 Nov AUER FILM FRAMES Standard Auer frames are used by all major manufacturers of wafer processing equipment for mounted wafer applications throughout the el...Continue reading
03 Nov AUER FLAT CARRIERS Auer Precision’s practical approach to solving problems now provides the next generation of flat carriers – the flat boat. These carrie...Continue reading
03 Nov AUER PROCESS CARRIERS Standard carriers are manufactured with the benefit of custom design. Carriers are manufactured using progressive master dies and inser...Continue reading
03 Nov UniTemp RVS-210 Reflow Vacuum System The RVS-210 Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean ro...Continue reading
03 Nov UniTemp RSS-210-S Vacuum Reflow Solder System The RSS-210-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and ...Continue reading