UniTemp RSS-110-S

Mini Vacuum Reflow Solder System
The RSS-110-S Reflow Solder System is a very compact and easy useable tool for the use in laboratories and clean rooms as table top unit. The chamber is vacuum sealed and equipped with a viewing window. This allows the view control of the soldering process. The unit is standard equipped with a Mass Flow Controller for the process gas.

The reflow solder system is perfect for the following applications:

flux-less soldering
flip chip process
adhesive bonding
solder bump reflowing
encapsulation of housings
soldering of power devices
heat treatment of semiconductor wafers
prototype development
quality control

Technical Data:

heated area: 110 mm x 110 mm (= model RSS-110-S)
chamber height: 40 mm (optional up to 80 mm)
viewing window with 60 mm dia.
Mass Flow controller for Nitrogen (5 nlm)
vacuum atmosphere up to 10exp.-3 hPa (KF16 connector)
temperature up to 400 °C (optional up to 500 °C)
ramp up rate: better 120 K/minute
ramp down rate: better 180 K/minute
SIMATIC© process control with 50 programs and 50 steps each
7″ touch panel
water cooled chamber (controlled and watched)
electrical connection type: 230V, 1.6 kW or 115V, 1.2 kW

Options and accessories

FA I	Formic acid module (separate module, not integrated) with Mass Flow Controller
RSS-EH	Chamber height 80mm instead of 40mm
RSS-H2	Hydrogen Module: for using 100% Hydrogen incl. gas line with Mass Flow Controller
RSS-H2S	Safety device to prevent uncontrolled emission of Hydrogen
RSS-IL	Interlock mechanism during operation
RSS-TC	Additional thermocouple (max. 1 pc)
VAC I	Basic Vacuum up to 3 hPa, incl. vacuum sensor and valve, excl. pump
VAC II	Comfort Vacuum up to 10E-3 hPa, incl, vacuum sensor and valve, excl. pump
MP	Membrane/Diapgraghm pump for vacuum up to 3 hPa
MPC	Chemical resistant membrane pump for vakuum up to 3 hPa
RVP	Rotary vane pump for vacuum up to 10E-3 hPa with oilfilter
WC I	Closed loop water cooling system